Manufacturing Engineer

About the role

ICEYE is seeking a Manufacturing Engineer to own the manufacturability of electronic hardware from prototype through production for its Space Systems division. You will act as the technical bridge between design engineers and PCB/PCBA suppliers, ensuring that designs are production‑ready and that any issues are resolved early.

Key responsibilities

• Review schematics and PCB layouts for manufacturability, including stack‑ups, routing, power integrity, grounding, and impedance control.
• Conduct DFM/DFA reviews covering panelization, drill sizes, annular rings, solder mask, and copper balancing.
• Analyse manufacturer DFM reports, negotiate design changes, and issue Engineering Change Orders (ECOs).
• Maintain PCB/PCBA documentation such as Gerbers, ODB++, IPC‑2581, BOMs, and pick‑and‑place files.
• Support test strategy implementation (flying probe, ICT, boundary scan, functional test, AOI, X‑ray).
• Apply IPC standards for defect analysis, root‑cause investigation, and failure reporting.
• Evaluate component footprints and packages for assembly risk and work with fab/SMT partners on soldering, stencil design, and surface finishes.
• Manage supplier relationships, track issues, and coordinate scheduling.

Required profile

• 3+ years of manufacturing or process engineering experience in aerospace, defense, or another high‑reliability industry.
• Degree in Manufacturing, Electrical, Industrial Engineering or a related field.
• Strong communication skills to collaborate with designers, suppliers, and cross‑functional teams.

Required skills

• PCB design and layout review
• Design for Manufacturing (DFM) and Design for Assembly (DFA)
• Panelization, drill size optimization, annular ring analysis
• Solder mask design and copper balancing
• Engineering Change Orders (ECO) management
• Gerber, ODB++, IPC‑2581 file handling
• Bill of Materials (BOM) and pick‑and‑place programming
• Flying probe, In‑Circuit Test (ICT), boundary scan, AOI, X‑ray inspection
• IPC standards compliance and failure analysis
• Component footprint evaluation, stencil design, surface finish selection
• SMT supplier coordination